Coffee Rave/Exhibition

Press Conference

Opening

Queue Pitching

- Introduction of our exhibitors on stage

Opening Keynote "From Emerging Technologies to European Leadership"

This two-part keynote explored Europe’s semiconductor future from both a technological and strategic perspective.
The first session highlighted emerging manufacturing technologies, from advanced photomasks to Nanoimprint Lithography (NIL).
The second focused on the European Chips Act, the future semiconductor framework and the next steps needed to strengthen Europe’s technological sovereignty and global competitiveness.

Innovation Lab "Dual Use"

The Lab "Dual Use" explored the growing importance of defence technologies as a driver of innovation. The session focused on dual-use technologies, technological sovereignty and collaboration between industry, research and public institutions to strengthen Europe’s resilience and long-term innovation capacity.

Semiconductor Future Lab powered by AT-C3

The "Semiconductor Future Lab" explored the key challenges and opportunities shaping Europe’s semiconductor industry. The discussion focused on emerging technologies, new chip architectures, more resilient supply chains, skills and talent, and how Europe could strengthen its long-term position in global competition.

- Warm Up before the second half of the day

Keynote "The Scale Up Europe Fund"

Europe has a strong base of innovative technology companies and deep expertise in key future technologies. One of its biggest challenges, however, is scaling these companies beyond the early stages and enabling them to compete globally.
Hermann Hauser highlighted why Europe’s ability to scale technology companies is critical to its future competitiveness, with a particular focus on larger growth financing rounds and the planned €5 billion "Scale Up Europe Fund".
The keynote directly reflected the conference theme “Crossroads. Decide. Disrupt. Deliver.” and asked which decisions Europe must make today to turn technological strength into global market leadership.

Demo Day Infineon Startup Challenge

- the winning startups presented their projects on stage

Panel "Europe's Semiconductor Value Chain"

Europe has world-class expertise across the semiconductor value chain. The challenge is to connect these strengths more effectively.

Which collaborations are already delivering results? Where are the missing links and where does untapped potential remain? This panel looked at concrete opportunities to strengthen cooperation across companies, industries and borders, and asked whether Europe needs new platforms, initiatives or structures to make collaboration faster and more effective.

The goal: to turn individual strengths into a more connected, resilient and globally competitive European semiconductor ecosystem.

Speakers:
- Jan Preibisch, Senior VP Corporate Strategy | AT&S
- Brian Hotani, Venture Development and Special Projects | SPRIND
- Wolfgang Steinbauer, CEO & CTO NXP Austria | NXP Semiconductors Austria
- Peter Strutzmann, Senior Manager, Innovation, Funding & Research Cooperation | Lam Research
- Martin Haintz, Founder & Software Consultant | HAINTZ IT SOLUTIONS

- Room 12

Closing & Wrap Up